(L-R): Srini Chinamilli, Co founder & CEO, Tessolve; and Jens Benndorf, CEO, Dream Chip Technologies: Scripting India’s chip sojourn in Europe
In a landmark development, Tessolve, the chip design arm of India’s Hero Electronix, a venture that visualizes, creates and sustains technology-based business entities, has signed of a definitive agreement to fully acquire Dream Chip Technologies, a Germany-based semiconductor design firm, for a consideration of ₹400 Crore (EUR 42.5 Million).
This acquisition positions Tessolve among a select group of design firms worldwide capable of delivering turnkey design solutions for complex cutting-edge chips. It further strengthens Tessolve’s leadership in the industry by adding advanced capabilities in System on Chip (SoC) designs for the artificial intelligence (AI), automotive, data center, and industrial markets.
The acquisition will also expand Tessolve’s European operations by adding four delivery locations across Germany and Netherlands, including a specialized ADAS & imaging center-of-excellence lab, reinforcing Tessolve’s commitment to providing cutting-edge semiconductor and embedded design solutions while expanding its market share in the semiconductor services sector.
“Over the past few years, Tessolve has demonstrated impressive growth and resilience. With the synergy brought by Dream Chip Technologies, I am confident that Tessolve is poised to become a world leader in this space with unparalleled capabilities. As major companies increasingly shift towards custom chip design, this acquisition positions Tessolve more strongly than ever to meet the growing demands of the custom chip market, says Ujjwal Munjal, Chairman of Tessolve.
The Great Handshake
Jens Benndorf, CEO, Dream Chip Technologies, comments, “We’re excited to join forces with Tessolve and bring our expertise in digital chip design and embedded software to a global platform. “Together, we will push the boundaries of innovation in automotive and enterprise designs, particularly in camera-based systems and AI-driven ASIC applications.” “we can offer our customers a truly end-to-end solution from chip architecture to post-silicon test and supply chain management for their most complex designs.”,” elaborates Benndorf.
“This acquisition solidifies our position as a top tier semiconductor engineering firm globally with unmatched design to productization capabilities,” says Srini Chinamilli, Co-founder & CEO of Tessolve. “Dream Chip’s capabilities further strengthen our ability to take on leading edge ASIC design projects and greatly enhances our European footprint,” adds he.
Dream Chip Technologies is recognized as one of the leading semiconductor design service companies in Europe, particularly for its expertise in complex digital designs. Its chip architecture and front-end design capabilities combined with Tessolve’s strengths in chip design and excellence in post-silicon test and packaging design, will enhance the company’s ability to deliver full chip turnkey design solutions.
Qaisar
